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DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D119
BYD43 series Fast soft-recovery rectifiers
Product specification Supersedes data of February 1995 1996 Jun 05
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Available in ammo-pack.
handbook, 4 columns
BYD43 series
and fatigue free as coefficients of expansion of all used parts are matched.
(1) Implotec is a trademark of Philips.
DESCRIPTION Cavity free cylindrical glass package through ImplotecTM(1) technology. This package is hermetically sealed
k
a
MAM123
Fig.1 Simplified outline (SOD81) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM BYD43U BYD43V BYD43-16 BYD43-18 BYD43-20 VRRM repetitive peak reverse voltage BYD43U BYD43V BYD43-16 BYD43-18 BYD43-20 IF(AV) average forward current BYD43U and V BYD43-16 to 20 IF(AV) average forward current BYD43U and V BYD43-16 to 20 IFRM repetitive peak forward current BYD43U and V BYD43-16 to 20 IFRM repetitive peak forward current BYD43U and V BYD43-16 to 20 Tamb = 65 C; see Figs 8 and 9 - - 6.0 3.2 A A Ttp = 55 C; lead length = 10 mm; see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 Tamb = 65 C; PCB mounting (see Fig.20); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11 Ttp = 55 C; see Figs 6 and 7 - - 11 6 A A - - - - - - - - - 1200 1400 1600 1800 2000 1.20 0.68 V V V V V A A PARAMETER non-repetitive peak reverse voltage - - - - - 1300 1500 1700 1900 2100 V V V V V CONDITIONS MIN. MAX. UNIT
0.65 0.30
A A
1996 Jun 05
2
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
SYMBOL IFSM
PARAMETER non-repetitive peak forward current BYD43U and V BYD43-16 to 20
CONDITIONS t = 10 ms half sinewave; Tj = Tj max prior to surge; VR = VRRMmax
MIN. - - -65
MAX. 6 6 +175 +175 A A
UNIT
Tstg Tj
storage temperature junction temperature see Figs 12 and 13
C C
-65
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage BYD43U and V BYD43-16 to 20 VF forward voltage BYD43U and V BYD43-16 to 20 IR reverse current BYD43U and V BYD43-16 to 20 IR reverse current BYD43U and V BYD43-16 to 20 trr reverse recovery time BYD43U and V BYD43-16 to 20 Cd diode capacitance BYD43U and V BYD43-16 to 20 dI R -------dt maximum slope of reverse recovery current BYD43U and V BYD43-16 to 20 THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.20. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm VALUE 60 120 UNIT K/W K/W when switched from IF = 1 A to VR 30 V and dIF/dt = -1 A/s; see Fig.21 VR = VRRMmax Tj = 165 C; see Fig 16 Tj = 125 C; see Fig 17 when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig 22 f = 1 MHz; VR = 0 V; see Figs 18 and 19 - - - - - - - - - - 100 50 250 300 A A ns ns VR = VRRMmax; see Figs 16 and 17 IF = 1 A; see Figs 14 and 15 CONDITIONS IF = 1 A; Tj = Tj max; see Figs 14 and 15 MIN. - - - - - - TYP. - - - - - - MAX. 1.20 2.05 1.5 2.4 1 5 V V V V A A UNIT
20 15
- -
pF pF
- -
- -
5 5
A/s A/s
1996 Jun 05
3
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
GRAPHICAL DATA
BYD43 series
handbook, halfpage
1.6
MLC311
handbook, halfpage
0.8
MLC315
I F(AV) (A) 1.2 lead length 10 mm
I F(AV) (A) 0.6 lead length 10 mm
0.8
0.4
0.4
0.2
0 0 BYD43U and V a = 1.42; VR = VRRMmax; = 0.5. Switched mode application. 100 T tp ( oC) 200
0 0 BYD43-16 to 20 a = 1.42; VR = VRRMmax; = 0.5. Switched mode application. 100 T tp ( oC) 200
Fig.2
Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
Fig.3
Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
handbook, halfpage
1.0 I F(AV) (A) 0.8
MLC312
handbook, halfpage
0.5 I F(AV) (A) 0.4
MLC316
0.6
0.3
0.4
0.2
0.2
0.1
0
0
100
Tamb ( o C)
200
0
0
100
Tamb ( o C)
200
BYD43U and V a = 1.42; VR = VRRMmax; = 0.5. Device mounted as shown in Fig.20. Switched mode application.
BYD43-16 to 20 a = 1.42; VR = VRRMmax; = 0.5. Device mounted as shown in Fig.20. Switched mode application.
Fig.4
Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
Fig.5
Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
1996 Jun 05
4
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
handbook, full pagewidth
12
MLC320
I FRM (A) 10 = 0.05
8 0.1 6 0.2 4 0.5 2 1 0 10 2
10 1
1
10
10 2
10 3
t p (ms)
10 4
BYD43U and V Ttp = 55 C; Rth j-tp = 60 K/W. VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 1 400 V.
Fig.6 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
8
MLC322
I FRM (A) 6 = 0.05
4 0.1
0.2 2 0.5
1 0 10 2
10 1
1
10
10 2
10 3
t p (ms)
10 4
BYD43-16 to 20 Ttp = 55 C; Rth j-tp = 60 K/W. VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 2000 V.
Fig.7 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Jun 05
5
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
handbook, full pagewidth
8
MLC321
I FRM (A) 6 = 0.05
4 0.1
0.2 2 0.5
1 0 10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4
BYD43U and V Tamb = 65 C; Rth j-a = 120 K/W. VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 1400 V.
Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
handbook, full pagewidth
4
MLC323
I FRM (A) 3 = 0.05
2
0.1
0.2 1 0.5 1 0 10 2
10 1
1
10
10 2
10 3
t p (ms)
10 4
BYD43-16 to 20 Tamb = 65 C; Rth j-a = 120 K/W. VRRMmax during 1 - ; curves include derating for Tj max at VRRM = 2000 V.
Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1996 Jun 05
6
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
handbook, halfpage
3
MLC310
handbook, halfpage
3
MLC314
P (W) a = 3 2.5 2 1.57 2 1.42
P (W) a = 3 2.5 2 1.57 2 1.42
1
1
0
0
1
I F(AV) (A)
2
0
0
0.5
I F(AV) (A)
1.0
BYD43U and V a = IF(RMS)/IF(AV); VR = VRRMmax; = 0.5.
BYD43-16 to 20 a = IF(RMS)/IF(AV); VR = VRRMmax; = 0.5.
Fig.10 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current.
Fig.11 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current.
handbook, halfpage
200
MLC265
handbook, halfpage
200
MLC318
Tj ( oC)
Tj ( oC)
100
100
BYD43U
BYD43V
BYD43-16
18
20
0
0
1000
VR (V)
2000
0
0
1000
VR (V)
2000
BYD43-16 to 20 BYD43U and V VRRM; = 0.5. Dotted line = VRRM; = 0.1. Solid line = VRRM; = 0.5.
Fig.12 Maximum permissible junction temperature as a function of reverse voltage.
Fig.13 Maximum permissible junction temperature as a function of reverse voltage.
1996 Jun 05
7
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
handbook, halfpage
6
MLC309
handbook, halfpage
3
MLC192
IF (A) 4
IF (A) 2
2
1
0
0 0 1 2 V F (V) 3
0
2
V F (V)
4
BYD43U and V Dotted line: Tj = 175 C. Solid line: Tj = 25 C.
BYD43-16 to 20 Dotted line: Tj = 175 C. Solid line: Tj = 25 C.
Fig.14 Forward current as a function of forward voltage; maximum values.
Fig.15 Forward current as a function of forward voltage; maximum values.
103 handbook, halfpage IR (A) 102
MLC313
103 handbook, halfpage IR (A) 102
MLC319
10
10
1
0
100
Tj ( o C)
200
1
0
100
Tj ( o C)
200
BYD43U and V VR = VRRMmax.
BYD43-16 to 20 VR = VRRMmax.
Fig.16 Reverse current as a function of junction temperature; maximum values.
Fig.17 Reverse current as a function of junction temperature; maximum values.
1996 Jun 05
8
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
102 handbook, halfpage
MLC305
handbook, halfpage
10
MLC317
Cd (pF)
Cd (pF)
10
1 1 10
102
V R (V)
103
1 1 10
102
V R (V)
103
BYD43U and V f = 1 MHz; Tj = 25 C.
BYD43-16 to 20 f = 1 MHz; Tj = 25 C.
Fig.18 Diode capacitance as a function of reverse voltage; typical values.
Fig.19 Diode capacitance as a function of reverse voltage; typical values.
handbook, halfpage
50 25 IF handbook, halfpage dI F 7 50 dt t rr 10% t dI R dt 2 IR 3
MGA200
100%
MGC499
Dimensions in mm.
Fig.20 Device mounted on a printed-circuit board.
Fig.21 Reverse recovery definitions.
1996 Jun 05
9
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
BYD43 series
handbook, full pagewidth
DUT +
IF (A) 0.5 1 t rr
10
25 V 50 0 0.25 0.5 IR (A) 1
t
MAM057
Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 15 ns.
Fig.22 Test circuit and reverse recovery time waveform and definition.
1996 Jun 05
10
Philips Semiconductors
Product specification
Fast soft-recovery rectifiers
PACKAGE OUTLINE
BYD43 series
handbook, full pagewidth
5 max 0.81 max 2.15 max
MBC051
28 min
3.8 max
28 min
Dimensions in mm. The marking band indicates the cathode.
Fig.23 SOD81.
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1996 Jun 05
11

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